Magnetic Particle Inspection Level 2 Practice Exam

What is the next operation after believing that a defect has been removed by chipping or grinding?

1. Repair it

2. Measure to see if minimum thickness remains

3. Reexamine the area by magnetic particle testing

4. Sign off the part

The correct answer is: Reexamine the area by magnetic particle testing

After the process of chipping or grinding to remove a defect, the next logical step is to reexamine the area by magnetic particle testing. This step is crucial as it confirms whether the defect has indeed been eliminated and ensures that the integrity of the material has been restored. Magnetic particle testing is specifically designed to detect surface and near-surface discontinuities, making it the appropriate technique to validate that the repair was successful. The reexamination helps in identifying any remaining flaws that may not have been completely removed during the initial repair process. It's essential to ensure that the part meets the required standards and specifications before further processing or approval. Other options, while related to the repair process, do not directly follow the action of chipping or grinding aimed at removing a defect. For instance, measuring minimum thickness may be necessary if there's a concern about material loss, but it does not provide immediate confirmation of a successful defect removal. Signing off on the part would typically occur after verifying its safety and compliance with standards, while simply stating that the part needs repair does not encompass the necessary validation process following a potential defect removal. Thus, reexamining the area with magnetic particle testing is the most appropriate and systematic next step.